Mattson Technology, Inc. (MTSN) announced on October 11th that the company will host a conference call on Wednesday, October 24, 2012 at 5:00 p.m. Eastern Time. The conference call will cover 2012 third quarter financial results and current business conditions.
Technology:
The Helios® features an advanced model based temperature measurement and control system that provides the uniformity, repeatability and reliability required for achieving superior device performance for the most demanding 300 mm applications, targeting source drain anneals or other high temperature anneals.
The Helios XP features an advanced model-based temperature measurement and control system combined with an active compensation algorithm for different wafer emissivities. The system’s outstanding spike anneal performance, with rapid ramp and cool-down rates provides the precise process control required for ultra-shallow junction formation.
The Millios™ millisecond (ms) anneal system is Mattson Technology’s solution for ultra-shallow junction formation, advanced silicides and other processes requiring extremely short anneal times with precise control. Millios expands Mattson’s philosophy of affording its customers the lowest Cost of Ownership paired with leading edge technology.
Mattson Etch systems have been designed to address the stringent technology and Cost-of-Ownership (CoO) requirements of the Etch market. Mattson Etchers utilize Mattson’s patented Faraday-Shielded inductively coupled plasma (ICP) source technology, along with bias capability for anisotropic etching of 300-mm wafers. This differentiated processing technology allows Mattson to deliver the best on wafer performance at the ever-shrinking technology nodes. Furthermore, Mattson Etchers leverage another core expertise of the company; very high throughput wafer transfer platforms. Mattson’s differentiated process technology along with the very high throughput wafer platforms allows Mattson to deliver etching solutions with highest on-wafer performance at lowest CoO
Fabrication of integrated circuits with feature sizes under 90 nanometer requires advanced dry strip technologies such as our Suprema and Alpine Strip systems. In addition, faster IC devices require the use of advanced materials, such as low and ultra-low capacitance, or Low-k/ULK dielectrics, copper, metal gates, and silicides. The use of these new materials creates new challenges for photoresist stripping equipment. The resist or residues must be removed from these materials without degrading critical performance characteristics and device yield. At 32nm and below, critical ultra-shallow junctions (USJ) require cleaning processes that meet 0.3 angstroms of silicon loss per clean step according to ITRS (International Technology Roadmap for Semiconductors) specifications. Combined with the use of ULK at k values below 2.5, removing residues and preserving capacitance values requires the most advanced hardware and process capabilities.
Mattson Technology Inc.
47131 Bayside Parkway
Fremont, CA 94538
Tel: 510-657-5900
Fax: 510-492-5911
Mattson Technology, Inc. designs, manufactures, and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. The Company is a leading supplier of dry strip and rapid thermal processing equipment to the global semiconductor industry. Its strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices.